DocumentCode :
252778
Title :
Package characterization of FET-based biochemical sensors
Author :
Voitsekhivska, T. ; Suthau, E. ; Kirsten, S. ; Schubert, M. ; Zorgiebel, F. ; Cuniberti, G. ; Wolter, K.-J.
Author_Institution :
Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany
fYear :
2014
fDate :
3-5 Dec. 2014
Firstpage :
725
Lastpage :
729
Abstract :
In this study we present packaging techniques for SD-card form factor test adapters. Our test adapters consist of FET-based biochemical sensors and a CMOS integrated analog multiplexer connected to a printed circuit board (PCB). Protection of the test adapter is required for long term stability and reliable measurements of the biochemical sensor in a liquid environment. Two different encapsulation techniques and biocompatible materials with different thermo-mechanical properties were used for this purpose. Adhesive strength measurements of these encapsulants on different substrates were carried out. Finally, the package was integrated into a portable measurement system for multiplexed measurements. Measured gate characteristics were compared between blank and packaged test adapters. FET characteristics were measured in dry as well as in liquid environment. Our packaging technique is mechanically stable, suitable for measurements in liquid environments influences neither the electrical characteristics of the FET devices as nor data acquisition.
Keywords :
CMOS analogue integrated circuits; biosensors; field effect transistors; integrated circuit packaging; printed circuits; CMOS integrated analog multiplexer; FET-based biochemical sensors; PCB; SD-card form factor test adapters; adhesive strength measurements; biocompatible materials; blank test adapters; encapsulation techniques; liquid environment; multiplexed measurements; package characterization; packaged test adapters; portable measurement system; printed circuit board; thermomechanical properties; Biosensors; Encapsulation; Liquids; Microfluidics; Plastics; Semiconductor device measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
Type :
conf
DOI :
10.1109/EPTC.2014.7028338
Filename :
7028338
Link To Document :
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