• DocumentCode
    252784
  • Title

    A micro resonant acceleration sensor comprising silicon support with temperature isolator and quartz doubled ended tuning fork

  • Author

    Cun Li ; Yulong Zhao ; Rongjun Cheng

  • Author_Institution
    State Key Lab. for Manuf. Syst. Eng., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2014
  • fDate
    13-16 April 2014
  • Firstpage
    346
  • Lastpage
    349
  • Abstract
    We present a micro resonant acceleration sensor based on the frequency shift of quartz double ended tuning fork (DETF). The two stiff ends of DETF are mounted on proof mass and temperature isolator structure of silicon support, respectively. Electrodes are coated on the four surfaces of the resonant beam to excite anti-phase vibration model to balance inner stress and torque. Stress in DETF beam shifts when the proof mass is applied to acceleration, which changes resonance frequency of DETF. The temperature isolator structure is designed to reduce the impact of thermal stress due to the difference of thermal expansion coefficient between quartz and silicon. The silicon support and DETF are fabricated based on the bulk micromachining technology. Self-excited circuit is also designed to excite DETF. The proposed sensor is simply packaged for measurement. The sensor takes advantages of both quartz and silicon materials to achieve a micro resonant sensor with simple processing for digital acceleration measurements.
  • Keywords
    accelerometers; microsensors; quartz; silicon; thermal expansion; vibrations; digital acceleration measurements; frequency shift; micro resonant acceleration sensor; proof mass; quartz doubled ended tuning fork; resonance frequency; resonant beam; self excited circuit; silicon support; temperature isolator structure; thermal expansion coefficient; thermal stress; Acceleration; Isolators; Resonant frequency; Robot sensing systems; Silicon; Stress; Vibrations; DETF; acceleration sensor; resonant; temeperature isolator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on
  • Conference_Location
    Waikiki Beach, HI
  • Type

    conf

  • DOI
    10.1109/NEMS.2014.6908823
  • Filename
    6908823