• DocumentCode
    2527962
  • Title

    Characterization of bias-stressed carbon-doped GaAs/AlGaAs power heterojunction bipolar transistors

  • Author

    Henderson, T. ; Hill, D. ; Liu, W. ; Costa, D. ; Chau, H.-F. ; Kim, T.S. ; Khatibzadeh, A.

  • Author_Institution
    Central Res. Labs., Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1994
  • fDate
    11-14 Dec. 1994
  • Firstpage
    187
  • Lastpage
    190
  • Abstract
    We report on the performance of carbon-doped heterojunction bipolar transistors (HBTs) bias stressed at elevated temperatures. We have determined that in devices without a thin passivating layer of AlGaAs covering the extrinsic base, a tunneling-recombination current that increases in magnitude with the duration of the stress is generated. This current is seen in both the collector and the base at cryogenic temperatures. The variation of this current with temperature is primarily due to carrier freeze-out in the AlGaAs emitter. We hypothesize that this conduction mechanism is related to the generation of midgap traps in the base layer as a result of electron-hole recombination events.<>
  • Keywords
    III-V semiconductors; aluminium compounds; carbon; electron traps; electron-hole recombination; failure analysis; gallium arsenide; heterojunction bipolar transistors; hole traps; power bipolar transistors; semiconductor device reliability; tunnelling; C-doped HBT; GaAs:C-AlGaAs; base layer; bias-stressed transistor; carrier freeze-out; characterization; conduction mechanism; electron-hole recombination events; elevated temperatures; failure mode; heterojunction bipolar transistors; midgap traps; power HBT; tunneling-recombination current; Degradation; Failure analysis; Fingers; Gallium arsenide; Heterojunction bipolar transistors; Instruments; Laboratories; Leakage current; Stress; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2111-1
  • Type

    conf

  • DOI
    10.1109/IEDM.1994.383434
  • Filename
    383434