Title :
Accelerated testing of multi-walled CNT composite electrical contacts for MEMS switches
Author :
Lewis, A.P. ; McBride, J.W. ; Suan Hui Pu ; Liudi Jiang
Author_Institution :
Fac. of Eng. & the Environ., Univ. of Southampton, Southampton, UK
Abstract :
The use of gold-coated multi-walled carbon nanotube (Au/MWCNT) bilayer composite surfaces has been discussed in previous work as a method for improving the reliability of switch contacts [1, 2]. A consequence of large lifetimes means that testing to failure is time consuming. To address this we developed a MEMS-based test platform which enables testing at high frequency [3]. The MEMS devices were developed in a two stage process. In this paper the results obtained from the first stage design for a MEMS-based test platform device are discussed. Further to this, an overview of the design of the second stage device is given. Using the first-stage device, at a current of 50 mA (at 4 V), the composite yielded a lifetime in excess of 44 million hot-switching cycles [4]. At a lower load current of 10 mA, the contact maintained a stable contact for >500 million hot-switching cycles. As well as monitoring the contact resistance, SEM images of the surface before and after testing are presented. The first stage MEMS-based developmental device is a step towards a smaller integrated and packaged high-lifetime metal-contacting MEMS switch. An overview of the considerations for the redesign is given with a discussion on the predicted performance and improvement for accelerated switch testing.
Keywords :
carbon nanotubes; contact resistance; electron device testing; gold; microswitches; nanocomposites; nanocontacts; reliability; scanning electron microscopy; Au-C; MEMS-based test platform; SEM images; accelerated switch testing; contact resistance; current 50 mA; gold-coated multiwalled carbon nanotube bilayer composite surfaces; metal-contacting MEMS switch; multiwalled CNT composite electrical contacts; reliability; voltage 4 V; Contacts; Gold; Microswitches; Structural beams; Switching circuits; Testing;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028348