DocumentCode
2528125
Title
BIST: required for embedded DRAM
Author
Tanoi, Satoru
Author_Institution
LSI Div., OKI Electr. Ind. Co. Ltd., Japan
fYear
1998
fDate
18-23 Oct 1998
Firstpage
1149
Abstract
In the virtual component (VC) integration business, the embedded DRAM is a key VC to realize high bit density and high bandwidth performance, thus the low-cost testing of DRAM-integrated LSI is an emerging problem. The DRAM test usually includes a fail-bit (address) search to repair the memory cell defects with redundancy, requiring long time for wafer probing. A DRAM BIST drastically reduces time of both wafer probing and final test, compared with test by only ATE. In the VC-LSI testing, BIST for embedded DRAM is also required to reduce the test time and to realize VC test isolation
Keywords
DRAM chips; automatic testing; built-in self test; design for testability; integrated circuit testing; large scale integration; DRAM BIST; DRAM-integrated LSI; LSI design; embedded DRAM; fail-bit search; high bandwidth performance; high bit density; high parallelism; low-cost testing; memory cell defects; reduced test time; redundancy; test isolation; virtual component integration; virtual component-LSI testing; Bandwidth; Built-in self-test; Circuit testing; Costs; Large scale integration; Logic testing; Probes; Random access memory; Redundancy; Virtual colonoscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1998. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-5093-6
Type
conf
DOI
10.1109/TEST.1998.743349
Filename
743349
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