• DocumentCode
    2528209
  • Title

    How real is the new SIA roadmap for mixed-signal test equipment?

  • Author

    Ortner, William R.

  • Author_Institution
    Lucent Technol., Bell Labs., Allentown, PA, USA
  • fYear
    1998
  • fDate
    18-23 Oct 1998
  • Firstpage
    1153
  • Abstract
    The 1997 SIA roadmap for test equipment is summarized in two tables-Microprocessor and ASIC Test Equipment Requirements, for digital test, and Mixed Signal Test Equipment Requirements, for analog instrument requirements. The digital test equipment needs for mixed signal devices is expected to be the same as for purely digital devices. The clear trend for digital is toward higher pin count and higher speed and we fully expect to see complex analog functions on the same silicon with all this digital-the so called Systems-On-A-Chip. As a principal contributor and the coordinator for the SIA mixed signal test requirements, I would like to comment on how real the mixed signal roadmap appears one year later
  • Keywords
    automatic test equipment; electronics industry; integrated circuit testing; mixed analogue-digital integrated circuits; 1997 SIA Roadmap; ATE requirements; analog instrument requirements; cost of test; mixed-signal test equipment; systems-on-a-chip; Application specific integrated circuits; Circuit testing; Costs; Instruments; Jitter; Microprocessors; Silicon; System testing; Test equipment; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1998. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-5093-6
  • Type

    conf

  • DOI
    10.1109/TEST.1998.743352
  • Filename
    743352