Title :
The stuck-at fault: it ain´t over ´til it´s over
Author :
Butler, Kenneth M.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
The stuck-at fault has weathered at least two major revolutions in the manufacture of electronic components, the transition from tubes to solid state, and the move from bipolar to MOS technologies. It has been applied successfully in all three domains. It seems unlikely that future digital technologies will invalidate the use of the model. In conclusion, as long as the stuck-at fault model remains useful, it should not be abandoned in favour of other defect models. Investigations into new models and test techniques should continue, with the idea that they will probably be used to complement existing stuck-at-based methodologies
Keywords :
automatic test pattern generation; fault simulation; integrated circuit testing; logic testing; ATPG; automated diagnosis; bridging defect; model value; modelling simplicity; stuck-at fault model; test effectiveness; CMOS integrated circuits; CMOS technology; Fault detection; Fault diagnosis; Instruments; Integrated circuit modeling; Integrated circuit testing; Isolation technology; Manufacturing; Semiconductor device modeling;
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5093-6
DOI :
10.1109/TEST.1998.743357
