• DocumentCode
    2528313
  • Title

    Stuck-at fault: a fault model for the next millennium

  • Author

    Patel, Janak H.

  • Author_Institution
    Illinois Univ., Urbana, IL, USA
  • fYear
    1998
  • fDate
    18-23 Oct 1998
  • Firstpage
    1166
  • Abstract
    One of the common misconceptions about a stuck-at fault model is that it does not model a physical defect accurately and therefore is not adequate for testing defects in advancing technologies. Stuck-at fault model can be described as anything but a physical defect model. You can call it abstract, logical, Boolean, symbolic, functional or behavioral model, but don´t call it a physical defect model! But that is not a weakness of the stuck-at fault model. To the contrary, abstraction is the main strength of this model and the reason for its longevity. Abstraction is also the reason that it will be the model of choice in the next millenium. By staying away from physical details stuck-at fault model remains effective with changing technologies and design styles. Stuck-at fault model operates in the logic domain while most physical level models operate in analog domain or even in the electromagnetic domain. With the rapidly growing number of transistors on a chip, abstraction is a necessity to manage complexity. So if anything the trend for the next millenium is likely to be a higher level of abstraction. Does the abstraction come at a cost in loss of defect detection? To answer this let us consider two major classes of defects: defects internal to a gate and defects external to a gate
  • Keywords
    automatic testing; fault diagnosis; integrated circuit testing; logic gates; logic testing; abstraction; defect detection; fault model; gate external defects; gate internal defects; logic domain; stuck-at faults; Boolean functions; CMOS logic circuits; CMOS process; Costs; Fault detection; Logic gates; Logic testing; Performance evaluation; Semiconductor device modeling; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1998. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-5093-6
  • Type

    conf

  • DOI
    10.1109/TEST.1998.743358
  • Filename
    743358