Micromachined sensors using polysilicon sacrificial layer etching technology

Author

Sugiyama, S. ; Tabata, O. ; Shimaoka, K. ; Asahi, R.

Author_Institution

Toyota Central Res. & Dev. Labs. Inc., Aichi, Japan

fYear

1994

fDate

11-14 Dec. 1994

Firstpage

127

Lastpage

130

Abstract

Sensor assembly is one of the key technologies to improve the cost performance of silicon sensors. As a technology to achieve this aim, polysilicon sacrificial layer etching technology is presented. As its applications, a microdiaphragm pressure sensor with a reference pressure chamber and an integrated pyroelectric infrared sensor with a thermal isolated structure are also presented. Fabrication of a micro optical chopper is shown, and the future style of sensor devices is proposed.<>

Keywords

etching; infrared detectors; integrated circuit technology; micromachining; microsensors; pressure sensors; pyroelectric detectors; semiconductor technology; silicon; Si; Si sensors; etching technology; fabrication; integrated pyroelectric IR sensor; micro optical chopper; microdiaphragm pressure sensor; micromachined sensors; polysilicon sacrificial layer etching; reference pressure chamber; thermal isolated structure; Assembly; Costs; Etching; Infrared sensors; Isolation technology; Optical device fabrication; Optical sensors; Pyroelectricity; Silicon; Thermal sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International

Conference_Location

San Francisco, CA, USA

ISSN

0163-1918

Print_ISBN

0-7803-2111-1

Type

conf

DOI

10.1109/IEDM.1994.383448

Filename

383448