• DocumentCode
    2528378
  • Title

    An SOI thermal-diffusivity-based temperature sensor with ±0.6°C (3Σ) untrimmed inaccuracy from −70°C to 170°C

  • Author

    van Vroonhoven, C.P.L. ; Makinwa, K.A.A.

  • Author_Institution
    Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    2887
  • Lastpage
    2890
  • Abstract
    This work presents the first thermal-diffusivity-based temperature sensor in SOI technology; it has an untrimmed inaccuracy of ±0.6°C (3π) from -70°C up to 170°C and uses up to 7x less power than prior art. The sensor uses an electrothermal filter (ETF) to measure the thermal diffusivity of silicon, D, which has a well-defined 1/T1.8 temperature dependence. The ETF´s output is digitized by a phase-domain sigma-delta modulator. Measured data from several process lots show that that the sensor´s inaccuracy is limited by lithographic spread, and not by wafer-to-wafer or batch-to-batch variations.
  • Keywords
    filters; silicon-on-insulator; temperature measurement; temperature sensors; thermal diffusivity; ETF; SOI thermal-diffusivity-based temperature sensor; batch-to-batch variations; electrothermal filter; lithographic spread; phase-domain sigma-delta modulator; temperature -0.6 degC; temperature -70 degC to 170 degC; temperature 0.6 degC; thermal diffusivity measurement; wafer-to-wafer variations; CMOS integrated circuits; Doping; Heating; Silicon; Temperature measurement; Temperature sensors; Heat diffusion; Smart Sensors; Temperature Sensors; Thermal Diffusivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969119
  • Filename
    5969119