Title :
Monolithic-integrated silicon bulk-micromachined accelerometer and pressure-sensor for tire-pressure-monitoring-system (TPMS) application
Author :
Wang, Jiachou ; Li, Xinxin
Author_Institution :
State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Shanghai, China
Abstract :
A single-sided micromachined TPMS sensor is proposed and fabricated for automobiles, which is with a piezoresistive pressure sensor and a cantilever-mass piezoresistive accelerometer monolithically integrated in a 1.6mm×1.5mm sized (111) silicon chip. Single-wafer-based front-side silicon micromachining and metal electroplating technologies are employed to fabricate the device. Specially designed releasing trenches along 〈111〉 orientation are constructed to form the hexagonal pressure-sensitive diaphragm and the post-sealed vacuum reference-cavity. The fabrication of the accelerometer is also based on a hexagonal diaphragm that is latterly cut into suspended cantilevers and seismic-mass. Fabricated with the low-cost front-side micromachining technique, the small-sized TPMS sensors are promising in practical applications and volume production.
Keywords :
accelerometers; electroplating; elemental semiconductors; microfabrication; micromachining; microsensors; piezoresistive devices; pressure measurement; pressure sensors; silicon; tyres; Si; automobiles; cantilever-mass piezoresistive accelerometer; hexagonal pressure-sensitive diaphragm; metal electroplating technology; monolithic-integrated silicon bulk-micromachined accelerometer; piezoresistive pressure sensor; post-sealed vacuum reference-cavity; pressure sensor; single-sided micromachined TPMS sensor; single-wafer-based front-side silicon micromachining; small-sized TPMS sensors; tire-pressure-monitoring-system application; Accelerometers; Cavity resonators; Copper; Etching; Fabrication; Micromachining; Silicon; TPMS sensor; accelerometer; front-side micromachining; piezoresistance; pressure sensor;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0157-3
DOI :
10.1109/TRANSDUCERS.2011.5969145