DocumentCode :
2528976
Title :
A mechanical origin for electrical ageing and breakdown in polymeric insulation
Author :
Conner, P. ; Jones, J.P. ; Llewellyn, J.P. ; Lewis, T.J.
Author_Institution :
Inst. of Molecular & Biomolecular Electron., Univ. of Wales, Bangor, UK
fYear :
1998
fDate :
22-25 Jun 1998
Firstpage :
434
Lastpage :
438
Abstract :
The failure of polyolifinic solids, such as polyethylene and polypropylene, by fracture under mechanical stress has been studied extensively. The initial stages of such failure are considered to involve the scission of the main polymeric bonds, the generation of free radicals which induce bond-breaking chain reactions and the consequent growth of a population of sub-microscopic voids which ultimately coalesce into a propagating crack. Accompanying these processes is so-called fracto-emission, the generation of charged particles and electromagnetic radiation by fracture. All these features bear such remarkable resemblance to those occurring in the early stages of electrical breakdown of these same polymers that it becomes imperative to consider whether electrical breakdown has a mechanical origin. It has been suggested already that an electrical field in a dielectric will set up a mechanical stress which can become significant when the field approaches breakdown values (>108 V/m). The presence of this mechanical stress, which must be taken into account when considering the internal equilibrium of a dielectric, is not intuitively obvious but a number of results support its existence. In this paper, we outline the main features of the theoretical model for this stress and then describe new experiments which strikingly demonstrate its presence in polyethylene and polypropylene films under electrical stress. The implications of this demonstration for electrical ageing and breakdown are clear
Keywords :
ageing; dielectric thin films; electric breakdown; insulating thin films; internal stresses; materials testing; modelling; organic insulating materials; polyethylene insulation; polymer films; bond-breaking chain reactions; dielectric materials; electrical ageing; electrical breakdown; electrical field; electrical stress; fracto-emission; fracture; insulation failure; mechanical origin; mechanical stress; polyethylene films; polymeric insulation; polymers; polyolifinic solids; polypropylene films; propagating crack; submicroscopic voids; theoretical model; Aging; Bonding; Dielectrics; Electric breakdown; Electromagnetic propagation; Electromagnetic radiation; Polyethylene; Polymers; Solids; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Conduction and Breakdown in Solid Dielectrics, 1998. ICSD '98. Proceedings of the 1998 IEEE 6th International Conference on
Conference_Location :
Vasteras
Print_ISBN :
0-7803-4237-2
Type :
conf
DOI :
10.1109/ICSD.1998.709318
Filename :
709318
Link To Document :
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