Title :
Monolithic pressure+acceleration sensor with self-test function for reliable & low-cost tire-pressure-monitoring-system (TPMS) applications
Author :
Wei, C.Z. ; Zhou, W. ; Wang, Q. ; Li, Xinxin
Author_Institution :
State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Shanghai, China
Abstract :
Reported is a surface-micromachined piezoresistive composite sensor, with both pressure sensor and accelerometer integrated in a 1.6mm×1.6mm chip for low-cost automobile tire-pressure monitor system (TPMS) application [1]. The two sensors are fabricated with compatible surface-micromachining process. Using a LIGA like process, a Cu thick-layer is electroplated and patterned on the accelerometer mass region to improve sensitivity. A self-test function is designed for the accelerometer to monitor the mechanically fragile sensor for reliable application. By detecting the wheel-rotation induced centrifugal acceleration, a -25g~+125g accelerometer is used to wake-up a 550kPa-ranged pressure sensor in a power-saving mode. The fabricated pressure sensor has a sensitivity of 0.08mV/KPa under 3V power supply and the linearity is about 0.3%FS. The sensitivity of the acceleration sensor is tested as 30μV/g.
Keywords :
LIGA; accelerometers; automatic testing; composite materials; electroplating; micromachining; monitoring; piezoresistive devices; pressure sensors; tyres; wheels; LIGA like process; accelerometer mass region; accelerometer sensor; fragile sensor; low-cost automobile TPMS application; low-cost automobile tire-pressure monitor system application; power-saving mode; pressure 550 kPa; pressure measurement; pressure sensor; self-test function; surface-micromachined piezoresistive composite sensor; voltage 3 V; Accelerometers; Built-in self-test; Copper; Piezoresistance; Sensitivity; Silicon; Silicon compounds; Surface-micromachining; accelerometer; poly-silicon piezoresistor; pressure sensor; self-testing;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0157-3
DOI :
10.1109/TRANSDUCERS.2011.5969155