Heat conduction study across metal/graphene interface by molecular dynamics

Author

Fulong Zhu ; Kai Tang ; Ying Li ; Ke Duan ; Sheng Liu ; Yanming Chen

Author_Institution

Sch. of Mech. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2014

fDate

3-5 Dec. 2014

Firstpage

833

Lastpage

836

Abstract

Thermal properties of different metal/graphene interfaces were analyzed by molecular dynamics (MD). Thermal interface conductance of three metal/graphene interfaces, Ni/graphene, Cu/graphene, and Au/graphene, was investigated from 200K to 500K. For Cu/single-layer graphene (SLG) and Ni/SLG interfaces, thermal interface conductance was independent of temperature. Thermal interface conductance was around 537 W/m²K for Ni/SLG interface, and around 465W/m²K for Cu/SLG interface. Thermal interface conductance increased from 236W/m²K to 265 W/m²K from 200K to 500K. It was found to be caused by interactions between graphene and different metal at metal/graphene interface. For thermal management of graphene devices, Ni could be better choices of metal thermal contacts with graphene.

Keywords

copper; gold; graphene; heat conduction; nickel; thermal conductivity; thermal management (packaging); Au-C; Cu-C; Ni-C; graphene devices; heat conduction; metal thermal contacts; metal-graphene interface; molecular dynamics; temperature 200 K to 500 K; thermal interface conductance; thermal management; Electronic packaging thermal management; Gold; Graphene; Heating; Nickel; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th

Conference_Location

Singapore

Type

conf

DOI

10.1109/EPTC.2014.7028411

Filename

7028411