Design and implementation of a novel CMOS MEMS condenser microphone with corrugated diaphragm

Author

Huang, Chien-Hsin ; Tsai, Ming-Han ; Lee, Chien-Hsing ; Hsieh, Tsung-Min ; Liou, Jhyy-Cheng ; Chen, Li-Che ; Yip, Ming-Chuen ; Fang, Weileun

fYear

2011

fDate

5-9 June 2011

Firstpage

1026

Lastpage

1029

Abstract

This study reports a CMOS-MEMS condenser microphone implemented using the standard thin films stacking of 0.35μm UMC CMOS 3.3/5.0V logic process, and followed by post-CMOS micromachining steps without introducing any special materials. The corrugated diaphragm for microphone is designed and implemented using the metal layer to reduce the influence of thin film residual stresses. Moreover, silicon substrate is employed to increase the stiffness of back-plate. Measurements show the sensitivity of microphone is -42±3dBV/Pa at 1kHz under 6V pumping voltage, the frequency response is 100Hz-10kHz, and the S/N ratio >;55dB. Table1 summarizes detail specifications.

Keywords

CMOS logic circuits; diaphragms; frequency response; internal stresses; micromachining; micromechanical devices; microphones; thin film devices; CMOS MEMS condenser microphone; Si; UMC CMOS logic process; corrugated diaphragm; frequency 100 Hz to 10 kHz; metal layer; post-CMOS micromachining step; size 0.35 mum; thin film residual stress; voltage 6 V; CMOS integrated circuits; CMOS process; Micromechanical devices; Microphones; Semiconductor device measurement; Sensitivity; Silicon; CMOS-MEMS; condenser microphone; corrugated; diaphragm; sensitivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Conference_Location

Beijing

ISSN

Pending

Print_ISBN

978-1-4577-0157-3

Type

conf

DOI

10.1109/TRANSDUCERS.2011.5969162

Filename

5969162