Title :
Fabrication and testing of a high resolution extensometer based on resonant MEMS strain sensors
Author :
Ferri, M. ; Belsito, L. ; Mancarella, F. ; Masini, L. ; Roncaglia, A. ; Yan, J. ; Seshia, A.A. ; Zalesky, J. ; Soga, K.
Author_Institution :
Inst. of Microelectron. & Microsyst., CNR, Bologna, Italy
Abstract :
A novel type of linear extensometer with exceptionally high resolution of 4 nm based on MEMS resonant strain sensors bonded on steel and operating in a vacuum package is presented. The tool is implemented by means of a steel thin bar that can be pre-stressed in tension within two fixing anchors. The extension of the bar is detected by using two vacuum-packaged resonant MEMS double-ended tuning fork (DETF) sensors bonded on the bar with epoxy glue, one of which is utilized for temperature compensation. Both sensors are driven by a closed loop self-oscillating transresistance amplifier feedback scheme implemented on a PCB (Printed Circuit Board). On the same board, a microcontroller-based frequency measurement circuit is also implemented, which is able to count the square wave fronts of the MEMS oscillator output with a resolution of 20 nsec. The system provides a frequency noise of 0.2 Hz corresponding to an extension resolution of 4 nm for the extensometer. Nearly perfect temperature compensation of the frequency output is achieved in the temperature range 20-35°C using the reference sensor.
Keywords :
adhesives; amplifiers; compensation; extensometers; feedback; frequency measurement; microcontrollers; microfabrication; microsensors; oscillators; printed circuits; strain sensors; vibrations; MEMS oscillator; PCB; closed loop self-oscillating transresistance amplifier feedback scheme; epoxy glue; frequency 0.2 Hz; high resolution linear extensometer; microcontroller-based frequency measurement circuit; printed circuit board; resonant MEMS strain sensor; square wave front; temperature 20 degC to 35 degC; temperature compensation; time 20 ns; vacuum-packaged resonant MEMS DETF sensor; vacuum-packaged resonant MEMS double-ended tuning fork sensor; Frequency measurement; Mechanical sensors; Micromechanical devices; Steel; Strain; Temperature sensors; Extensometer; MEMS resonator; strain sensor; vacuum packaging;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0157-3
DOI :
10.1109/TRANSDUCERS.2011.5969171