Title :
Frequency jumps on BVA and other precision quartz crystal resonators and burst-noise on overtone mode high-frequency quartz crystal resonators
Author :
Tuladhar, Kanak K. ; Jenni, Géerald
Author_Institution :
Oscilloquartz SA, Neuchatel, Switzerland
Abstract :
In this paper recently classified intermittent and discrete frequency jump phenomena are briefly reviewed and currently not well understood abrupt frequency jump phenomena are analysed and discussed in detail. These abrupt frequency jumps are caused due to minute and subtle manufacturing imperfections within the precision resonators. Although abrupt jumps actually originate in the precision resonators, non-optimum oscillator circuit can exaggerate the problem even more. Burst-noise observed on the high-frequency overtone-mode quartz crystal resonator is also currently not understood. This phenomenon can also be attributed to subtle and minute manufacturing imperfections within the resonators. Two suggestions are put forward to minimise burst-noise on the high-frequency overtone-mode quartz crystal resonators. Then it is postulated that to minimise abrupt frequency jumps on the precision AT- and SC-cut resonators a new resonator package other than HC-36/U (or HC-27/U) and HC-40/U(or near equivalent glass package) will be required. Two new possible packages are proposed. Finally, a number of actions taken to minimise abrupt frequency jumps on a 5 MHz third-overtone mode SC-cut BVA resonator are detailed
Keywords :
crystal resonators; electron device noise; equivalent circuits; frequency stability; packaging; quartz; 5 MHz; AT-cut resonators; BVA resonator; SC-cut resonators; SiO2; abrupt frequency jumps; burst noise; frequency jump phenomena; manufacturing imperfections; overtone mode HF resonators; precision quartz crystal resonators; resonator package; Circuit faults; Circuit noise; Equivalent circuits; Glass; Levee; Manufacturing; Oscillators; Packaging; Phase noise; Resonant frequency;
Conference_Titel :
Frequency Control Symposium, 1996. 50th., Proceedings of the 1996 IEEE International.
Conference_Location :
Honolulu, HI
Print_ISBN :
0-7803-3309-8
DOI :
10.1109/FREQ.1996.559877