• DocumentCode
    2530557
  • Title

    Performance analysis of grinding process via particle swarm optimization

  • Author

    Ting, T.O. ; Lee, T.S. ; HTay, Than

  • Author_Institution
    Fac. of Eng., Multimedia Univ., Malacca, Malaysia
  • fYear
    2005
  • fDate
    16-18 Aug. 2005
  • Firstpage
    92
  • Lastpage
    97
  • Abstract
    Optimization is necessary for the control of any process to achieve better product quality, high productivity with low cost. The grinding of silicon carbide is not an easy task due to its low fracture toughness, making the material sensitive to cracking. The efficient grinding involves the optimal selection of operating parameters to maximize the material removal rate (MRR) while maintaining the required surface finish and limiting surface damage. In this work, optimization based on the available model has been carried out to obtain optimum parameters for silicon carbide grinding via particle swarm optimization (PSO) based on the objective of maximizing MRR with reference to surface finish and damage. Results obtained are superior in comparison with genetic algorithm (GA) approach.
  • Keywords
    genetic algorithms; grinding; machining; particle swarm optimisation; process control; silicon compounds; surface finishing; genetic algorithm; grinding process; material removal rate; particle swarm optimization; process control; silicon carbide grinding; surface damage limitation; surface finish; Bonding; Ceramics; Genetic algorithms; Machining; Particle swarm optimization; Performance analysis; Silicon carbide; Surface cracks; Surface finishing; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Intelligence and Multimedia Applications, 2005. Sixth International Conference on
  • Print_ISBN
    0-7695-2358-7
  • Type

    conf

  • DOI
    10.1109/ICCIMA.2005.45
  • Filename
    1540709