DocumentCode
2530557
Title
Performance analysis of grinding process via particle swarm optimization
Author
Ting, T.O. ; Lee, T.S. ; HTay, Than
Author_Institution
Fac. of Eng., Multimedia Univ., Malacca, Malaysia
fYear
2005
fDate
16-18 Aug. 2005
Firstpage
92
Lastpage
97
Abstract
Optimization is necessary for the control of any process to achieve better product quality, high productivity with low cost. The grinding of silicon carbide is not an easy task due to its low fracture toughness, making the material sensitive to cracking. The efficient grinding involves the optimal selection of operating parameters to maximize the material removal rate (MRR) while maintaining the required surface finish and limiting surface damage. In this work, optimization based on the available model has been carried out to obtain optimum parameters for silicon carbide grinding via particle swarm optimization (PSO) based on the objective of maximizing MRR with reference to surface finish and damage. Results obtained are superior in comparison with genetic algorithm (GA) approach.
Keywords
genetic algorithms; grinding; machining; particle swarm optimisation; process control; silicon compounds; surface finishing; genetic algorithm; grinding process; material removal rate; particle swarm optimization; process control; silicon carbide grinding; surface damage limitation; surface finish; Bonding; Ceramics; Genetic algorithms; Machining; Particle swarm optimization; Performance analysis; Silicon carbide; Surface cracks; Surface finishing; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Computational Intelligence and Multimedia Applications, 2005. Sixth International Conference on
Print_ISBN
0-7695-2358-7
Type
conf
DOI
10.1109/ICCIMA.2005.45
Filename
1540709
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