• DocumentCode
    2531661
  • Title

    Towards the limits of thick-film resistors´ miniaturization

  • Author

    Jozenków, Tomasz ; Nowak, Damian

  • Author_Institution
    Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
  • fYear
    2008
  • fDate
    20-22 June 2008
  • Firstpage
    28
  • Lastpage
    31
  • Abstract
    This paper presents results of investigations devoted to miniaturization of thick-film resistors with the aid of laser cutting. The investigations were aimed at miniaturization of two resistor dimensions, namely length and width. Test structures were based on various combination of conductive and resistive inks deposited on Al2O3, or LTCC substrates. Resistors made in standard screen printing process after being fired were patterned using laser beam in order to minimize their planar dimensions to tenths of millimeter and below. Prepared samples were subjected to number of electrical tests and some characteristic parameters, like temperature coefficient of resistance (TCR) or pulse durability were calculated based on these measurements. Test samples were also exposed to long-term thermal ageing. The received parameters were compared to those exhibited by resistors with standard dimensions in order to evaluate differences in characteristics and to determine the current miniaturization limits of such components.
  • Keywords
    ageing; electronic equipment testing; laser beam cutting; thick film resistors; electrical tests; laser cutting; miniaturization; pulse durability; resistor length; resistor width; screen printing process; temperature coefficient of resistance; test structures; thermal ageing; thick-film resistors; Electric resistance; Ink; Laser beam cutting; Laser beams; Printing; Pulse measurements; Pulsed laser deposition; Resistors; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photonics and Microsystems, 2008 International Students and Young Scientists Workshop -
  • Conference_Location
    Wroclaw
  • Print_ISBN
    978-1-4244-4971-2
  • Electronic_ISBN
    978-1-4244-2555-6
  • Type

    conf

  • DOI
    10.1109/STYSW.2008.5164136
  • Filename
    5164136