DocumentCode :
2531713
Title :
Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Author :
Sharma, A. ; Rieth, L. ; Tathireddy, P. ; Harrison, R. ; Oppermann, H. ; Klein, M. ; Töpper, M. ; Jung, E. ; Normann, R. ; Clark, G. ; Solzbacher, F.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Utah, Salt Lake City, UT, USA
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
1204
Lastpage :
1207
Abstract :
We evaluate the encapsulation and packaging reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA)/integrated neural interface-recording version 5 (INI-R5) by monitoring the extended long term in-vitro functional stability and recording longevity. The INI encapsulated with 6-μm Parylene-C was immersed in phosphate buffer saline (PBS) for a period of over 12 months. The full functionality and the ability of the electrodes to record artificial neural signals even after 12 months of PBS soak provides a measure of encapsulation reliability, the functional and recording stability in fully integrated wireless neural interface and potential usefulness for future chronic implants.
Keywords :
bioMEMS; bioelectric phenomena; biomedical electrodes; biomedical materials; microelectrodes; neurophysiology; prosthetics; INI-R5; PBS; Utah slant electrode array; artificial neural signal recording; chronic implants; encapsulation reliability; extended long term in vitro functional stability; fully integrated USEA; fully integrated wireless neural interface; fully wireless USEA; integrated neural interface recording version 5; long term USEA functionality; packaging reliability; parylene-C; phosphate buffer saline; recording longevity; Electrodes; Frequency shift keying; RF signals; Radio frequency; Time frequency analysis; Wireless communication; Wireless sensor networks; Integrated neural interface; long term functionality; wireless;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969317
Filename :
5969317
Link To Document :
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