Title :
Susceptibility of solder masks on solderballing and webbing in wave soldering
Author :
Platek, B.T. ; Tesarski, S.J.
Author_Institution :
Lab. for Interconnecting & Packaging Electron. Circuits, Wroclaw Univ. of Technol., Wroclaw, Poland
Abstract :
The goal of current paper is to investigate the impact of lead-free solders, solder masks and fluxes based on water on solderballing and webbing in wave soldering. Two tests for susceptibility of solder mask on solderballing and webbing (test I - solder float method and test II - wetting balance method) and one test for flux solids are presented.
Keywords :
masks; wave soldering; flux solids; lead-free solders; solder float method; solder mask susceptibility; solderballing; wave soldering; webbing; wetting balance method; Consumer electronics; Environmentally friendly manufacturing techniques; Lead; Photonics; Soldering; Solids; Solvents; Sputtering; Temperature sensors; Testing;
Conference_Titel :
Photonics and Microsystems, 2008 International Students and Young Scientists Workshop -
Conference_Location :
Wroclaw
Print_ISBN :
978-1-4244-4971-2
Electronic_ISBN :
978-1-4244-2555-6
DOI :
10.1109/STYSW.2008.5164144
