Title :
Thermal design of an HTP microthruster
Author :
Halswijk, Whc ; Moerel, Jlpa ; Sanders, Hm
Author_Institution :
TNO Defence Security & Safety, Netherlands
Abstract :
A microscale thruster, has been successsfully designed using MEMS technology, in that ´stacked wafer´ design is adopted.The thruster is built up of stacked and bonded silicon wafer, each with its own internal structure. The MEMS technology as succeed in acheiveing good performance and relatively short heat-up transient. This paper describes the preliminary design and detailed thermal analysis. The microthruster is designed to be used on small satellites,to deliver small impulse bits micro/nano-satellites for δV impulses.
Keywords :
aerospace propulsion; micromechanical devices; propellers; thermal analysis; wafer bonding; MEMS monopropellant microthruster; MEMS technology; bonded silicon wafer; high test peroxyde microthruster designing; internal structure; short heat-up transient; stacked wafer; thermal analysis; thermal design; Assembly; Chemical analysis; Fabrication; Fasteners; Feeds; Ignition; Micromechanical devices; Propulsion; Silicon; Temperature;
Conference_Titel :
MEMS, NANO and Smart Systems, 2005. Proceedings. 2005 International Conference on
Print_ISBN :
0-7695-2398-6
DOI :
10.1109/ICMENS.2005.124
