DocumentCode :
2532239
Title :
Subsurface microscopy of multilayered integrated circuits
Author :
Köklü, F. Hakan ; Ünlü, M. Selim
Author_Institution :
Dept. of Electr. & Comput. Eng., Boston Univ., Boston, MA, USA
fYear :
2009
fDate :
4-8 Oct. 2009
Firstpage :
357
Lastpage :
358
Abstract :
We demonstrate 325 nm lateral spatial resolution while imaging metal structures located inside the interconnect layer of a multilayered integrated circuit.
Keywords :
integrated circuit interconnections; optical images; imaging metal structures; interconnect layer; lateral spatial resolution; multilayered integrated circuits; subsurface microscopy; High-resolution imaging; Integrated circuit interconnections; Lenses; Lighting; Mirrors; Nails; Optical imaging; Optical microscopy; Polarization; Spatial resolution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
LEOS Annual Meeting Conference Proceedings, 2009. LEOS '09. IEEE
Conference_Location :
Belek-Antalya
ISSN :
1092-8081
Print_ISBN :
978-1-4244-3680-4
Electronic_ISBN :
1092-8081
Type :
conf
DOI :
10.1109/LEOS.2009.5343090
Filename :
5343090
Link To Document :
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