DocumentCode
2532438
Title
Micro systems technology: the way to shrink sun sensors
Author
Leijtens, Johan ; de Boom, Kees ; van der Heiden, Nico
Author_Institution
TNO Sci. & Ind., Delft, Netherlands
fYear
2005
fDate
24-27 July 2005
Firstpage
193
Lastpage
194
Abstract
High reliability sun sensors are currently built using silicon detectors and aperture masks which are supported at an accurate distance above the sensitive detector surface. By using micro systems technologies like bulk and surface micro machining and wafer level bonding, highly precise and accurate sensors can be devised that are expected to have comparable performance but much smaller dimensions and mass.
Keywords
micromachining; microsensors; silicon radiation detectors; sunlight; wafer bonding; aperture masks; bulk micromachining; microsystem technology; silicon detectors; sunsensors; surface micromachining; wafer level bonding; Apertures; Costs; Detectors; Earth; Micromachining; Sensor arrays; Sensor systems; Silicon; Sun; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
MEMS, NANO and Smart Systems, 2005. Proceedings. 2005 International Conference on
Print_ISBN
0-7695-2398-6
Type
conf
DOI
10.1109/ICMENS.2005.68
Filename
1540813
Link To Document