DocumentCode :
2532882
Title :
Fracture mechanical characterization of micro- and nano-filled polymers by a combined experimental and simulative procedure
Author :
Wunderle, Bemhard ; Dermitzaki, Emmanouella D. ; Keller, Jürgen ; Vogel, Dietmar ; Michel, Bernd
Author_Institution :
Dept. Mech. Reliability & Micro Mater., Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
fYear :
2004
fDate :
16-19 Aug. 2004
Firstpage :
186
Lastpage :
188
Abstract :
With the development of micro- and nanotechnological products such as sensors, MEMS and NEMS and their broad application new reliability issues arises. The authors present a combined experimental and simulative approach targeted on unsolved questions of size effects within newly developed nanomaterials and highly integrated systems. The experimental approach is based on the in-situ SPM scans of the analyzed object carried out at different thermomechanical load states. With the application of digital image correlation techniques displacement fields with nanometer accuracy are derived. A simulative approach is performed by homogenization which is the modeling of a representative volume of bulk material taking into account a spatial distribution of the filler particles. The results of the homogenization are input data for standard finite element codes.
Keywords :
Young´s modulus; filled polymers; finite element analysis; fracture; nanoparticles; scanning probe microscopy; thermal conductivity; thermal expansion; digital image correlation techniques; filler particles; finite element codes; fracture; homogenization; in-situ SPM scans; mechanical properties; microfilled polymers; microtechnological products; nanofilled polymers; nanomaterials; nanotechnological products; size effects; spatial distribution; thermomechanical load states; Code standards; Digital images; Mechanical sensors; Micromechanical devices; Nanoelectromechanical systems; Nanomaterials; Polymers; Scanning probe microscopy; Sensor phenomena and characterization; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology, 2004. 4th IEEE Conference on
Print_ISBN :
0-7803-8536-5
Type :
conf
DOI :
10.1109/NANO.2004.1392291
Filename :
1392291
Link To Document :
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