New film-type die attach adhesives

The development of film-type adhesives for die attach applications is described. The advantages of film-type adhesives, as well as some novel approaches being considered for both adhesives and conductor systems, are discussed. The purpose of this work is to develop adhesive films which can be applied to the wafer backside prior to dicing. Advantages of such a system include simplified adhesive-handling, delivery of precise adhesive quantities, elimination of resin-bleed problems and formation of uniform die perimeter fillets. Featuring the ability to be cured on the die bonder without the need to go offline for adhesive cure, these adhesives would also provide improved bond-line-thickness uniformity, elimination of tipped die and prevention of die float.<>