Awafer-level, heterogeneously integrated, high flow SMA-silicon gas microvalve

Author

Gradin, H. ; Braun, S. ; Stemme, G. ; van der Wijngaart, W.

Author_Institution

Microsyst. Technol. Lab., KTH R. Inst. of Technol., Stockholm, Sweden

fYear

2011

fDate

5-9 June 2011

Firstpage

1781

Lastpage

1784

Abstract

This paper presents a novel gas microvalve design in which a flow control gate is opened by the pneumatic pressure and closed by a SMA actuator, allowing large flow control. The microvalves were fabricated using a novel wafer-level Au-Si eutectic bonding process for TiNi to silicon integration. The resulting microvalves demonstrate a record pneumatic performance per footprint area; a microvalve of only 1×3.3 mm² footprint successfully controls 3000 sccm at a pressure drop of 130 kPa.

Keywords

bonding processes; flow control; microactuators; microfabrication; microvalves; silicon alloys; wafer level packaging; Au-Si; SMA actuator; Si; TiNi; flow control gate; high flow SMA-silicon gas microvalve design; pneumatic pressure; shape memory alloy; wafer-level eutectic bonding process; Actuators; Bonding; Gold; Logic gates; Microvalves; Silicon; Microvalve; SMA; TiNi; eutectic bonding; heterogeneous integration; shape memory alloy; wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Conference_Location

Beijing

ISSN

Pending

Print_ISBN

978-1-4577-0157-3

Type

conf

DOI

10.1109/TRANSDUCERS.2011.5969424

Filename

5969424