DocumentCode
25337
Title
Overlay Error Compensation Using Advanced Process Control With Dynamically Adjusted Proportional-Integral R2R Controller
Author
Chen-Fu Chien ; Ying-Jen Chen ; Chia-Yu Hsu ; Hung-Kai Wang
Author_Institution
Dept. of Ind. Eng. & Eng. Manage., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
11
Issue
2
fYear
2014
fDate
Apr-14
Firstpage
473
Lastpage
484
Abstract
As semiconductor manufacturing reaching nanotechnology, to obtain high resolution and alignment accuracy via minimizing overlay errors within the tolerance is crucial. To address the needs of changing production and process conditions, this study aims to propose a novel dynamically adjusted proportional-integral (DAPI) run-to-run (R2R) controller to adapt equipment parameters to enhance the overlay control performance. This study evaluates the performance of controllers via the variation of each overlay factor and the variation of maximum overlay errors in real settings. To validate the effectiveness of the proposed approach, an empirical study was conducted in a leading semiconductor company in Taiwan and the results showed practical viability of the proposed DAPI controller to reduce overlay errors effectively than conventional exponentially weighted moving average controller used in this company.
Keywords
PI control; compensation; control system synthesis; nanotechnology; process control; semiconductor device manufacture; DAPI controller; Taiwan; dynamically adjusted proportional-integral R2R controller; exponentially weighted moving average controller; nanotechnology; overlay control performance; overlay error compensation; overlay error minimization; process control; run-to-run controller; semiconductor company; semiconductor manufacturing; Companies; Fabrication; Lenses; Measurement uncertainty; Process control; Semiconductor device modeling; Advanced process control (APC); manufacturing intelligence; overlay errors; proportional-integral controller; run-to-run (R2R) control; yield enhancement;
fLanguage
English
Journal_Title
Automation Science and Engineering, IEEE Transactions on
Publisher
ieee
ISSN
1545-5955
Type
jour
DOI
10.1109/TASE.2013.2280618
Filename
6609079
Link To Document