• DocumentCode
    2534385
  • Title

    Does the burn-in of integrated circuits continue to be a meaningful course to pursue

  • Author

    Smith, William ; Khory, Noshir

  • Author_Institution
    Motorola Inc., Schaumburg, IL, USA
  • fYear
    1988
  • fDate
    9-11 May 1988
  • Firstpage
    507
  • Lastpage
    510
  • Abstract
    The mechanisms that control failure rate in early life are discussed, and the probable success of removing latent defects via burn-in or other means is analyzed using typical data. The analysis utilizes a first-order model of the instantaneous failure rate during early life and shows whether burn-in is appropriate or necessary for the product, and if so, what the duration of such burn-in should be. An understanding of the mechanisms which control latent defects (together with the likelihood of such latent defects causing failure) leads to the conclusion that a fully electronic product, which is designed with adequate operating margins, manufactured without defect, and always operated within its rated limits will never fail.<>
  • Keywords
    circuit reliability; failure analysis; integrated circuit testing; life testing; burn-in duration; electronic product; first-order model; instantaneous failure rate; integrated circuits; latent defects; life test; reliability; Acceleration; Aerospace industry; Costs; Failure analysis; Integrated circuit manufacture; Manufacturing; Plastics; Product design; Stress; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Components Conference, 1988., Proceedings of the 38th
  • Conference_Location
    Los Angeles, CA, USA
  • Type

    conf

  • DOI
    10.1109/ECC.1988.12640
  • Filename
    12640