DocumentCode
2534385
Title
Does the burn-in of integrated circuits continue to be a meaningful course to pursue
Author
Smith, William ; Khory, Noshir
Author_Institution
Motorola Inc., Schaumburg, IL, USA
fYear
1988
fDate
9-11 May 1988
Firstpage
507
Lastpage
510
Abstract
The mechanisms that control failure rate in early life are discussed, and the probable success of removing latent defects via burn-in or other means is analyzed using typical data. The analysis utilizes a first-order model of the instantaneous failure rate during early life and shows whether burn-in is appropriate or necessary for the product, and if so, what the duration of such burn-in should be. An understanding of the mechanisms which control latent defects (together with the likelihood of such latent defects causing failure) leads to the conclusion that a fully electronic product, which is designed with adequate operating margins, manufactured without defect, and always operated within its rated limits will never fail.<>
Keywords
circuit reliability; failure analysis; integrated circuit testing; life testing; burn-in duration; electronic product; first-order model; instantaneous failure rate; integrated circuits; latent defects; life test; reliability; Acceleration; Aerospace industry; Costs; Failure analysis; Integrated circuit manufacture; Manufacturing; Plastics; Product design; Stress; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location
Los Angeles, CA, USA
Type
conf
DOI
10.1109/ECC.1988.12640
Filename
12640
Link To Document