• DocumentCode
    2534459
  • Title

    Black silicon with sub-percent reflectivity: Influence of the 3D texturization geometry

  • Author

    Nguyen, K.N. ; Abi-Saab, D. ; Basset, P. ; Richalot, E. ; Marty, F. ; Angelescu, D. ; Leprince-Wang, Y. ; Bourouina, T.

  • Author_Institution
    ESIEE Paris, Univ. Paris-Est, Noisy-le-Grand, France
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    354
  • Lastpage
    357
  • Abstract
    In this paper we study the impact of the three-dimensional geometry of a micro/nanostructured silicon surface on its reflectivity under incident electromagnetic (EM) illumination. We simulate the optical reflectance of 3D micro/nano silicon cones of different dimensions. Based on the favorable simulation results, maskless textured silicon, called “black silicon” is processed by deep reactive ion etching (DRIE) under cryogenic temperatures. By varying the process parameters, we fabricate conical black silicon substrates with excellent anti-reflective behavior. Notable among the results, one of the samples exhibits the lowest reflectivity in the optical wavelength published to date for plasma-etched black-silicon.
  • Keywords
    elemental semiconductors; finite element analysis; light absorption; light reflection; nanostructured materials; reflectivity; silicon; sputter etching; 3D texturization geometry; Si; antireflective behavior; cryogenic temperature; deep reactive ion etching; incident electromagnetic illumination; maskless textured silicon; microstructured silicon surface; nanostructured silicon surface; optical reflectance; plasma etched black silicon; subpercent reflectivity; three dimensional geometry; Optical surface waves; Reflectivity; Silicon; Surface treatment; Surface waves; Three dimensional displays; Ultrafast optics; Black silicon; Cryogenic DRIE; light absorbing surface;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969470
  • Filename
    5969470