Title :
Wafer-level two-step bonding process for combined sensor with two different pressure chambers
Author :
Aono, T. ; Suzuki, K. ; Koide, A. ; Jeong, H. ; Degawa, M. ; Yamanaka, K. ; Hayashi, M.
Author_Institution :
Mech. Eng. Res. Lab., Hitachi, Ltd., Hitachi, Japan
Abstract :
We developed a wafer-level two-step anodic bonding process for a combined sensor with two different pressure chambers: ambient and low vacuum pressure. This two-step bonding process features: a bonding and non-bonding area controlled with a glass bump array, an anodic bonding process with plastic deformation of the glass bumps at high temperature and high loading, and two different pressure chambers formed with a sequence of bonding processes.
Keywords :
acceleration; bonding processes; gyroscopes; microsensors; plastic deformation; sensor arrays; wafer level packaging; glass bump array; low vacuum pressure; plastic deformation; pressure chamber; wafer-level two-step anodic bonding process; Acceleration; Bonding; Glass; Resists; Sensors; Substrates; Acceleration sensor; Anodic bonding; Combined sensor; Gyroscope; Wafer-level packaging;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0157-3
DOI :
10.1109/TRANSDUCERS.2011.5969480
