A transfer method for complex structures fabricated on non-planar surfaces

Author

Zeng, X. ; Huang, C. -C ; Jiang, H.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Wisconsin - Madison, Madison, WI, USA

fYear

2011

fDate

5-9 June 2011

Firstpage

402

Lastpage

405

Abstract

A method to fabricate complex structures on non-planar surfaces by utilizing a transfer method is presented. 3-dimensional and high-aspect-ratio microelectromechanical systems (MEMS) structures are transferred to flexible membranes, and can be further transferred to any non-planar surfaces. Here, we used a structure formed on a silicon-on-insulator (SOI) wafer by deep reactive-ion etching (DRIE) as an example. Both photoresist SU8-2050 and AZ 4620 were used as the flexible membranes. The effect of the structure and density of pillars on the transferring procedure was studied. Potentially this method could be utilized to transfer any MEMS structures and devices to any non-planar surfaces, thus possessing great potential in MEMS devices.

Keywords

microfabrication; photoresists; silicon-on-insulator; sputter etching; complex structures; deep reactive-ion etching; flexible membranes; microelectromechanical systems; nonplanar surfaces; photoresist; silicon-on-insulator wafer; transfer method; Arrays; Etching; Fabrication; Micromechanical devices; Polymers; Resists; Silicon; Fabrication; Flexible substrate; High-aspect ratio; Non-planar surface;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Conference_Location

Beijing

ISSN

Pending

Print_ISBN

978-1-4577-0157-3

Type

conf

DOI

10.1109/TRANSDUCERS.2011.5969488

Filename

5969488