• DocumentCode
    2535035
  • Title

    Novel post-process gap reduction technology of high aspect ratio microstructures ultilizing micro welding

  • Author

    Nowack, M. ; Leidich, S. ; Reuter, D. ; Kurth, S. ; Küchler, M. ; Bertz, A. ; Gessner, T.

  • Author_Institution
    Center for Microtechnologies, Chemnitz Univ. of Technol., Chemnitz, Germany
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    1352
  • Lastpage
    1355
  • Abstract
    This paper presents a novel post-process gap reduction technology of high aspect ratio microstructures. The gap reduction procedure uses the well known electrostatic deflection of a movable microstructure. In contrast to other solutions, micro welding is utilized to create the final, permanent locking. The fabrication technology, the functional principle of the gap reduction mechanism and the experimental set-up is presented. As a result the initial gap width between vertical comb electrodes was decreased from 4500 nm to 385 nm, leading to a final aspect ratio of 150.
  • Keywords
    microfabrication; welding; electrostatic deflection; high aspect ratio microstructures; micro welding; movable microstructure; post-process gap reduction technology; vertical comb electrodes; Electrodes; Microstructure; Multiplexing; Silicon; Switches; Welding; Gap reduction; HARMS; micro welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969505
  • Filename
    5969505