DocumentCode :
2535035
Title :
Novel post-process gap reduction technology of high aspect ratio microstructures ultilizing micro welding
Author :
Nowack, M. ; Leidich, S. ; Reuter, D. ; Kurth, S. ; Küchler, M. ; Bertz, A. ; Gessner, T.
Author_Institution :
Center for Microtechnologies, Chemnitz Univ. of Technol., Chemnitz, Germany
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
1352
Lastpage :
1355
Abstract :
This paper presents a novel post-process gap reduction technology of high aspect ratio microstructures. The gap reduction procedure uses the well known electrostatic deflection of a movable microstructure. In contrast to other solutions, micro welding is utilized to create the final, permanent locking. The fabrication technology, the functional principle of the gap reduction mechanism and the experimental set-up is presented. As a result the initial gap width between vertical comb electrodes was decreased from 4500 nm to 385 nm, leading to a final aspect ratio of 150.
Keywords :
microfabrication; welding; electrostatic deflection; high aspect ratio microstructures; micro welding; movable microstructure; post-process gap reduction technology; vertical comb electrodes; Electrodes; Microstructure; Multiplexing; Silicon; Switches; Welding; Gap reduction; HARMS; micro welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969505
Filename :
5969505
Link To Document :
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