DocumentCode
2535035
Title
Novel post-process gap reduction technology of high aspect ratio microstructures ultilizing micro welding
Author
Nowack, M. ; Leidich, S. ; Reuter, D. ; Kurth, S. ; Küchler, M. ; Bertz, A. ; Gessner, T.
Author_Institution
Center for Microtechnologies, Chemnitz Univ. of Technol., Chemnitz, Germany
fYear
2011
fDate
5-9 June 2011
Firstpage
1352
Lastpage
1355
Abstract
This paper presents a novel post-process gap reduction technology of high aspect ratio microstructures. The gap reduction procedure uses the well known electrostatic deflection of a movable microstructure. In contrast to other solutions, micro welding is utilized to create the final, permanent locking. The fabrication technology, the functional principle of the gap reduction mechanism and the experimental set-up is presented. As a result the initial gap width between vertical comb electrodes was decreased from 4500 nm to 385 nm, leading to a final aspect ratio of 150.
Keywords
microfabrication; welding; electrostatic deflection; high aspect ratio microstructures; micro welding; movable microstructure; post-process gap reduction technology; vertical comb electrodes; Electrodes; Microstructure; Multiplexing; Silicon; Switches; Welding; Gap reduction; HARMS; micro welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location
Beijing
ISSN
Pending
Print_ISBN
978-1-4577-0157-3
Type
conf
DOI
10.1109/TRANSDUCERS.2011.5969505
Filename
5969505
Link To Document