Title :
Metal electromigration induced by solder flux residue in hybrid microcircuits
Author :
Weiner, J.A. ; Benson, R.C. ; Romenesko, B.M. ; Nall, B.H. ; Charles, H.K., Jr.
Author_Institution :
Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA
Abstract :
Electrical failure due to excessive current-leakage was observed in a hybrid following burn-in. The current leakage was a result of extensive metal electromigration between substrate conductors, which has been correlated with flux residue in the device. It has been determined that water and other species are produced by thermal degradation of the flux during burn-in at 125 degrees C. Failure analysis results, along with associated materials and electronic testing, are reported.<>
Keywords :
electromigration; failure analysis; hybrid integrated circuits; integrated circuit testing; 125 degC; current leakage; electrical failure; electronic testing; failure analysis; hybrid microcircuits; metal electromigration; solder flux residue; substrate conductors; thermal degradation; Anodes; Cathodes; Chemicals; Conducting materials; Electromigration; Electronic packaging thermal management; Gold; Hybrid integrated circuits; Moisture; Surface contamination;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ECC.1988.12641
