Title :
Interconnection failures in circuit assemblies
Author_Institution :
Motorola Inc., Schaumburg, IL, USA
Abstract :
Examples of interconnection failures in circuit assemblies are reviewed. These interconnection failures are examples of corrosion and fraction of the metal circuit conductors. Failure mechanisms are described and modifications in design, process, or materials to eliminate the failure are provided, for each case study. In general, the failures examined are microscopic manifestations of familiar macroscopic corrosion and fraction mechanisms. The case studies of corrosion and fracture are described separately
Keywords :
corrosion; failure analysis; fracture; hybrid integrated circuits; integrated circuit technology; packaging; printed circuits; IC package; PCB; circuit assemblies; fraction mechanisms; fracture; hybrid circuit metallisation; interconnection failures; macroscopic corrosion; metal circuit conductors; Assembly; Conducting materials; Corrosion; Failure analysis; Gold; Heating; Integrated circuit interconnections; Packaging; Stress; Wire;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ECC.1988.12642
