Title :
Applications of parallel optical interconnects
Author :
Grimes, Gary J. ; Wong, Y.M. ; Anthony, P.J. ; Priest, E. ; Sherman, C.J. ; Peck, S.R. ; Holland, W.R. ; Muehler, D.J. ; Faudskar, C.C. ; Nyquist, J.S. ; Helton, J.S. ; Honea, W.K. ; Bortolini, J.R. ; Gates, J.V. ; Sonnier, G.L. ; Markush, J.P.C.
Author_Institution :
Bell Labs., Alabama Univ., Birmingham, AL, USA
Abstract :
The first phase of OETC (OETC-1) produced a parallel, 32-channel, high density (140 mm pitch), 500 Mb/s NRZ, point to point, optical data link. This link has a 32 channel VCSEL array operating at 850 nm and a 32 channel MCM receiver array. The key packaging technologies include the silicon optical bench technology and a multichip module technology. The transmitter and receiver parts were directly connected (no pigtails) using MACII-32 connectors.
Keywords :
integrated circuit packaging; laser cavity resonators; multichip modules; optical interconnections; optical receivers; optical transmitters; semiconductor laser arrays; surface emitting lasers; 32 channel MCM receiver array; 500 Mbit/s; 850 nm; MACII-32 connectors; Si; VCSEL array; high density; key packaging technologies; multichip module technology; parallel optical interconnects; point to point optical data link; receiver; silicon optical bench technology; transmitter; Connectors; Electronics packaging; Flexible printed circuits; Optical fiber cables; Optical interconnections; Optical receivers; Optical signal processing; Optical transmitters; Telecommunication switching; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-3160-5
DOI :
10.1109/LEOS.1996.571520
