A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration

This study presents an unique process to integrate the temperature sensing/heating elements, multi-layer through-hole vias (THVs), and electrical routings on parylene substrate to implement a multi-functional flexible temperature sensor array. Moreover, the polymer-staking processes with 3D electrical routings enable the further integration of various devices. In application, this study also demonstrates the implementation and integration of flexible temperature sensor array by: (1) temperature distribution and contour measurement using 4×4 temperature sensor array, (2) temperature monitoring and control using the integration of Pt-sensor and Pt-heater, (3) heterogeneous integration of temperature sensor array with LED-chip for LED temperature monitoring, and (4) 3D integration of temperature sensor array with LED and micro-lens and micro chamber.