• DocumentCode
    2535284
  • Title

    One step integration of gold coated sensors with OSTE polymer cartridges by low temperature dry bonding

  • Author

    Sandström, N. ; Shafagh, R.Z. ; Carlborg, C.F. ; Haraldsson, T. ; Stemme, G. ; van der Wijngaart, W.

  • Author_Institution
    Microsyst. Technol. Lab., KTH R. Inst. of Technol., Stockholm, Sweden
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    2778
  • Lastpage
    2781
  • Abstract
    We propose and demonstrate a novel one step method to integrate gold coated sensors with cartridges by dry covalent bonding. The cartridges are replica molded in an UV-curable off-stoichiometry thiol-ene (OSTE) polymer, featuring an excess of thiol functional groups that covalently bond to the surface of gold coated sensors upon contact. The method is demonstrated by the integration of a gold coated quartz crystal to a microfludic OSTE cartridge. The resulting bond interface is shown to be completely homogenous and void free and the package is tested successfully to a differential pressure of up to 2 bars. The performance of the biosensor chip is evaluated by measuring the unspecific binding of 0.5% albumin, resulting in a total frequency drop 205 Hz. This approach delivers a simple but rapid high quality integration aiming for the production of robust, low cost and disposable biosensor chips.
  • Keywords
    biosensors; bonding processes; moulding; surface plasmon resonance; OSTE polymer cartridges; UV-curable off-stoichiometry thiol-ene polymer; biosensor chip; dry covalent bonding; gold coated sensors; low temperature dry bonding; one step integration; replica molded; Biosensors; Bonding; Crystals; Gold; Polymers; Surface treatment; Biosensor; OSTE; QCM; SPR; gold; integration; microfluidics; off-stoichiometry thiol-ene; packaging; quartz crystal microbalance; surface plasmon resonance; thiol;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969534
  • Filename
    5969534