DocumentCode
2535288
Title
Ultrafast semiconductor thin disk lasers: Power scaling, wafer integration concept and optical versus electrical pumping
Author
Keller, U.
Author_Institution
Dept. of Phys., ETH Zurich, Zurich, Switzerland
fYear
2009
fDate
4-8 Oct. 2009
Firstpage
318
Lastpage
319
Abstract
This paper discusses the integration issues, the output power scaling and the potential for electrical pumping of modelocked integrated external-cavity surface emitting laser (MIXSEL) with semiconductor saturable absorber mirror (SESAM). The MIXSEL would be ideally suited for many applications where the current ultrafast laser technology is considered to be too bulky and expensive.
Keywords
high-speed optical techniques; laser mirrors; laser mode locking; optical pumping; optical saturable absorption; semiconductor lasers; surface emitting lasers; electrical pumping; laser mode locking; modelocked integrated external-cavity surface emitting laser; optical pumping; power scaling; semiconductor saturable absorber mirror; ultrafast semiconductor thin disk lasers; vertical external cavity surface emitting lasers; wafer integration; Integrated optics; Laser excitation; Laser modes; Optical pumping; Power lasers; Pump lasers; Semiconductor lasers; Stimulated emission; Surface emitting lasers; Ultrafast optics;
fLanguage
English
Publisher
ieee
Conference_Titel
LEOS Annual Meeting Conference Proceedings, 2009. LEOS '09. IEEE
Conference_Location
Belek-Antalya
ISSN
1092-8081
Print_ISBN
978-1-4244-3680-4
Electronic_ISBN
1092-8081
Type
conf
DOI
10.1109/LEOS.2009.5343254
Filename
5343254
Link To Document