Title :
Epoxy-less packaging methods for electrical contact to parylene-based flat flexible cables
Author :
Gutierrez, Christian A. ; Lee, Curtis ; Kim, Brian ; Meng, Ellis
Author_Institution :
Dept. of Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
Abstract :
We present two methods for establishing rapid epoxy-less electrical connectivity to Parylene-based flat flexible cables (FFC). The first utilizes commercially available zero-insertion-force (ZIF) connector technology and the second utilizes a custom-fabricated connector with an acrylic/polydimethylsiloxane (PDMS) interface featuring screen-printed contacts. A contact pitch of 0.5 mm was achieved using both connector methods. These techniques are simple to implement, reversible, scalable and unlike epoxy-based approaches, do not require manual intervention to secure individual contacts.
Keywords :
cables (electric); electric connectors; electrical contacts; electronics packaging; PDMS interface; ZIF connector technology; acrylic-polydimethylsiloxane interface; custom-fabricated connector; electrical contact; epoxy-less packaging method; parylene-based flat flexible cable; rapid epoxyless electrical connectivity; screen printed contact; size 0.5 mm; zero insertion force connector technology; Connectors; Contacts; Electrical resistance measurement; Fabrication; Force measurement; Resistance; Silver; Parylene C; flat flexible cable (FFC); screen printing; zero-insertion-force (ZIF);
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0157-3
DOI :
10.1109/TRANSDUCERS.2011.5969538
