Orientation-specific self-assembly at air-water interface using magnetic field

Author

Park, K.S. ; Baskaran, R. ; Böhringer, K.F.

Author_Institution

Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA

fYear

2011

fDate

5-9 June 2011

Firstpage

866

Lastpage

869

Abstract

This paper presents a novel method, supported by numerical and statistical analysis, to achieve orientation-specific self-assembly of millimeter-scale thin silicon parts from an air-water interface. Surface functionalized silicon parts (2000×2000×100 μm³) are assembled in preprogrammed hydrophilic locations on a substrate with self-alignment and unique orientation by a magnetic field.

Keywords

assembling; electron device manufacture; hydrophilicity; permanent magnets; printed circuit manufacture; self-assembly; statistical analysis; Si; air-water interface; fluidic self-assembly; magnetic field; millimeter scale thin silicon part; orientation specific self-assembly; preprogrammed hydrophilic location; size 100 mum; size 2000 mum; surface functionalized silicon parts; Assembly; Magnetic fields; Nickel; Self-assembly; Substrates; Surface treatment; Surface waves; Fluidic self-assembly; chips; dies; directed; heterogeneous system integration; orientation-specific; packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Conference_Location

Beijing

ISSN

Pending

Print_ISBN

978-1-4577-0157-3

Type

conf

DOI

10.1109/TRANSDUCERS.2011.5969545

Filename

5969545