DocumentCode :
2535509
Title :
Distribution of discharge magnitude under local breakdown condition in void
Author :
Seto, K. ; Matsuyama, M. ; Ito, T. ; Ehara, Y. ; Sakai, T.
Author_Institution :
Musashi Inst. of Technol., Tokyo, Japan
fYear :
1988
fDate :
12-16 Sep 1988
Firstpage :
400
Abstract :
Insulation deterioration tests were carried out using an internal-discharge-pulse measurement system with the aim of predicting the breakdown of electrical equipment. The system analyzes the distribution of discharge magnitude relative to each phase angle of the applied voltage (AC 50 Hz). The distribution of the discharge magnitude in the sample (consisting of three polyethylene layers) was measured, which was intentionally broken down in part of a void. It was found that, when the breakdown of one side of the sample took place, the number of discharge pulses of large magnitude decreased and the number of discharge pulses of small magnitude increased. When the change in the distribution of the discharge magnitude was observed the breakdown pit in one side of the sample was confirmed. It is concluded that the change in the distribution of the discharge magnitude could be used as a tool for the diagnosis of the deterioration of insulation
Keywords :
electric breakdown of solids; insulation testing; organic insulating materials; partial discharges; polymers; 50 Hz; AC voltage; breakdown pit; breakdown prediction; deterioration of insulation; diagnosis tool; discharge magnitude distribution change; distribution of discharge magnitude; insulation deterioration tests; internal-discharge-pulse measurement system; local breakdown condition in void; number of discharge pulses; partial discharges; phase angle; polyethylene layers; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Indium tin oxide; Microcomputers; Partial discharges; Pulse measurements; Testing; Thickness measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 1988. Proceedings., Second International Conference on Properties and Applications of
Conference_Location :
Beijing
Type :
conf
DOI :
10.1109/ICPADM.1988.38418
Filename :
38418
Link To Document :
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