Anodically-bondable LTCC substrates with novel nano-structured electrical interconnection for MEMS packaging

Author

Lin, Y.-C. ; Wang, W.-S. ; Chen, L.Y. ; Chen, M.W. ; Gessner, T. ; Esashi, M.

Author_Institution

WPI Adv. Inst. for Mater. Res., Tohoku Univ., Sendai, Japan

fYear

2011

fDate

5-9 June 2011

Firstpage

2351

Lastpage

2354

Abstract

In this study, anodically-bondable LTCC (low temperature cofired ceramic) substrates are proposed to provide electrical connective packaging by using novel nano-structured gold. On-chip MEMS compatible fabrication of nanoporous gold (NPG) was developed and its porous structure offers sponge-like functions which forms electrical contacts as well during anodic bonding. A MEMS integrated Si substrate is mechanically sealed to a metal feedthrough LTCC substrate by anodic bonding and its electrical connection is formed by the nanoporous structured pads simultaneously.

Keywords

bonding processes; ceramic packaging; gold; interconnections; micromechanical devices; nanocontacts; nanofabrication; nanoporous materials; seals (stoppers); semiconductor-metal boundaries; MEMS packaging; Si; anodically-bondable LTCC substrate; electrical connective packaging; electrical contacts; low temperature cofired ceramic; mechanical seal; nanoporous gold fabrication; nanostructured electrical interconnection; on-chip MEMS; Bonding; Gold; Micromechanical devices; Packaging; Silicon; Substrates; LTCC; MEMS packaging; Nanoporous gold; anodic bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Conference_Location

Beijing

ISSN

Pending

Print_ISBN

978-1-4577-0157-3

Type

conf

DOI

10.1109/TRANSDUCERS.2011.5969554

Filename

5969554