DocumentCode
2536244
Title
Insulation co-ordination for low-voltage equipment
Author
Stimper, Klaus
Author_Institution
Erlangen-Nurnberg Univ., West Germany
fYear
1988
fDate
12-16 Sep 1988
Firstpage
546
Abstract
For several years, insulation coordination for low-voltage equipment has been an important concern of several international committees. The reports 664 and 664 A of the International Electrical Commission (IEC) provided the basis for thorough investigations. In cooperation between the USA and Germany a large field exposure of electrical insulations has been carried out. About 30000 insulations under various voltages have been observed for several years. Insulation resistance and electrical strength were measured, and have yielded up to now about 10 million pieces of data. The author´s research group at the University of Erlangen took over the task of evaluating these results using statistical methods. In parallel, an intense research program has been carried out to quantify the influence of insulating materials, environmental conditions, and the design of the insulating systems on the long-term insulation behavior. The results of the statistical evaluations and the research program are under discussion in the German national standards committee. They are intended to support the drafting of scientifically founded revised standards on insulation coordination in the IEC
Keywords
electric strength; insulating materials; insulation testing; IEC; International Electrical Commission; electrical strength; insulating materials; insulation coordination; insulation resistance; long-term insulation behavior; low-voltage equipment; statistical methods; Conductivity; Dielectrics and electrical insulation; Electric resistance; Electrical resistance measurement; Humidity; IEC standards; International Committee; Surface resistance; Testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 1988. Proceedings., Second International Conference on Properties and Applications of
Conference_Location
Beijing
Type
conf
DOI
10.1109/ICPADM.1988.38454
Filename
38454
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