DocumentCode :
2536549
Title :
Pulsed Evaporative Transient Thermometry on isolated microstructures
Author :
Xiao, R. ; Wang, E.N.
Author_Institution :
Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
458
Lastpage :
461
Abstract :
Thin film evaporation promises ultra-high heat transfer rates for thermal management, however, few measurements provide fundamental insight into the evaporation process to achieve the theoretical limits. Here, we demonstrate a new metrology technique, Pulsed Evaporative Transient Thermometry (PETT), which utilizes a series of heating pulses of an isolated microstructure, where the transient thermal response is obtained to temporally resolve heat transfer coefficients during the evaporation process. We demonstrated the approach using a model system of unoxidized and oxidized copper microwires with a temporal resolution of 0.5 seconds. Distinct heat transfer signatures were obtained from PETT combined with optical microscopy to elucidate the effect of surface morphology on the evaporation process and heat transfer coefficients. The proposed metrology technique enables increased understanding of thin film evaporation on a variety of micro and nanostructures to realize advanced thermal management solutions.
Keywords :
evaporation; heat transfer; optical microscopy; surface morphology; thermal management (packaging); thermometers; thin films; transient response; PETT; heating pulse; isolated microstructure; metrology technique; microwires; nanostructures; optical microscopy; pulsed evaporative transient thermometry; surface morphology; thermal management; thin film evaporation; transient thermal response; ultra high heat transfer; Copper; Heat transfer; Microstructure; Surface morphology; Surface treatment; Transient analysis; Wires; evaporation; heat transfer; thermometry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969604
Filename :
5969604
Link To Document :
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