DocumentCode :
2536929
Title :
RApid prototyping of 3D microstructures by direct printing of liquid metal at temperatures up to 500°C using the starjet technology
Author :
Lass, N. ; Tropmann, A. ; Ernst, A. ; Zengerle, R. ; Koltay, P.
Author_Institution :
Lab. for MEMS Applic., Univ. of Freiburg, Freiburg, Germany
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
1452
Lastpage :
1455
Abstract :
We present a novel approach for 3D-prototyping of porous metal structures by direct non-contact liquid metal printing, based on the StarJet technology [1]. In contrast to our previous work, the presented droplet generator features an improved nozzle chip design and actuator housing that allows operation at temperatures up to Tmax = 500°C (formerly Tmax = 250°C). This enables the ejection of single droplets of metals with higher melting points like for example magnesium or zinc alloys like ZAMAK. The droplet generation frequency could be increased by a factor of 10 to fmax = 4 kHz. Furthermore, deviations of the droplet trajectory from the symmetry axis of the nozzle are reduced to Δdeg = 0.28° by the new design. This paper reports on experimental results obtained with the improved device and presents 3D metal structures with various porosities.
Keywords :
actuators; drops; ink jet printing; liquid metals; microfabrication; micromechanical devices; nozzles; rapid prototyping (industrial); 3D microstructure; 3D prototyping; actuator housing; direct noncontact liquid metal printing; direct printing; droplet generator feature; droplet trajectory; nozzle chip design; porous metal structure; rapid prototyping; starjet technology; Materials; Metals; Printing; Reservoirs; Rough surfaces; Surface morphology; Surface roughness; Liquid metal; StarJet; contactless printing; high melting; micro droplets; porous metal structures; rapid prototyping; solder printing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969623
Filename :
5969623
Link To Document :
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