DocumentCode :
2536949
Title :
AMTEC recirculating test cell component testing and operation
Author :
Underwood, M.L. ; Sievers, R.K. ; O´Connor, D. ; Williams, R.M. ; Jeffries-Nakamura, B. ; Bankston, C.P.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear :
1989
fDate :
6-11 Aug 1989
Firstpage :
2833
Abstract :
Alkali metal thermoelectric converter operation in a recirculating test cell (RTC), which requires a small electromagnetic pump (EM) and a high-temperature β" alumina-solid-electrolyte (BASE) 1-to-metal seal, is discussed. The design of a pump and an active metal braze seal and the initial operation of a cell using these components are described. The pump delivered 0.25 cm3/min against a 28-psia head. A braze seal system was selected after shear strength tests of Ta or Nb brazed to BASE by a variety of fillers including TiCuNi, TiNi, and TiNiCr. The TiCuNi filler was chosen for environment cell testing and showed no failure or observable degradation after short-term tests up to 1055 K. The pump and the Nb/TiCuNi/BASE seal were used in a test that demonstrated all the operational functions of the RTC for the first time. An increase in the radiation reduction factor at constant input power was observed, indicating that the condenser was being wet by sodium resulting in an increased reflectivity
Keywords :
brazing; electromagnetic devices; pumps; testing; thermoelectric conversion; β" alumina-solid-electrolyte; 1055 K; AMTEC; BASE; Nb; RTC; Ta; TiCuNi; TiNi; TiNiCr; active metal braze seal; alkali metal thermoelectric convertor; electromagnetic pump; environment cell testing; fillers; radiation reduction factor; recirculating test cell; reflectivity; shear strength tests; Electrodes; Electromagnetic launching; Heat pumps; Laboratories; Niobium; Resistance heating; Seals; Temperature; Testing; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1989. IECEC-89., Proceedings of the 24th Intersociety
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IECEC.1989.74395
Filename :
74395
Link To Document :
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