Title :
Sheet resistance and conductivity measurements of rough surfaces of metals on printed circuit boards and metalized ceramic substrates
Author :
Krupka, Jerzy ; Usydus, L. ; Koltuniak, H.
Author_Institution :
Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Warsaw, Poland
Abstract :
In copper cladded laminates copper foil is roughened to promote adhesion of the dielectric resin. Sheet resistance of rough metal surfaces increases as a function of frequency, thus increasing signal attenuation. In this paper we present measurements of the sheet resistance of rough metal surfaces on several commercially available copper cladded laminates and on metalized ceramic substrates.
Keywords :
adhesion; ceramics; copper; electric resistance measurement; electrical conductivity measurement; films; laminates; printed circuits; resins; rough surfaces; substrates; conductivity measurement; copper cladded laminate copper foil; dielectric resin adhesion; metal rough surface; metalized ceramic substrates; printed circuit boards; sheet resistance measurement; signal attenuation; conductivity; dielectric resonator; measurement; sheet resistance;
Conference_Titel :
Microwave Radar and Wireless Communications (MIKON), 2012 19th International Conference on
Conference_Location :
Warsaw
Print_ISBN :
978-1-4577-1435-1
DOI :
10.1109/MIKON.2012.6233535
