DocumentCode
2537572
Title
Frequency-temperature relations of thickness-shear and flexural vibrations of contoured quartz resonators
Author
Lee, P.C.Y. ; Wang, J.
Author_Institution
Dept. of Civil Eng. & Oper. Res., Princeton Univ., NJ, USA
fYear
1996
fDate
5-7 Jun 1996
Firstpage
632
Lastpage
639
Abstract
The two-dimensional first-order equations of incremental vibrations superposed on the steady and homogeneous thermal deformations of crystal plates by Lee and Yong are reduced to a set of four coupled equations for frequencies up to and including those of the fundamental x 1x2 (or slow) thickness-shear mode. These equations are employed to study the frequency-temperature relations of the thickness-shear and flexural vibrations of beveled plates of AT-cut of quartz. Closed form solutions for the uniform portion and analytical solutions in terms of infinite power series for the contoured portions are obtained. By requiring these solutions to satisfy the continuity conditions and traction-fret edge conditions, the frequency equation is obtained. Effects of the contouring and the orientation angle of the plate are examined systematically by computing the frequency changes as a function of temperature increment for various values of geometric parameters and the orientation angle of the plate. Similar results for the uniform and finite plates are also computed and presented for comparison
Keywords
crystal resonators; quartz; vibrations; AT-cut; SiO2; beveled crystal plate; continuity condition; contoured quartz resonator; flexural vibrations; frequency-temperature relations; orientation angle; power series; thermal deformation; thickness-shear vibrations; traction-fret edge condition; two-dimensional first-order equations; Capacitive sensors; Civil engineering; Equations; Frequency; Operations research; Temperature measurement; Thermal engineering; Thermal expansion; Thermal stresses; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium, 1996. 50th., Proceedings of the 1996 IEEE International.
Conference_Location
Honolulu, HI
Print_ISBN
0-7803-3309-8
Type
conf
DOI
10.1109/FREQ.1996.559944
Filename
559944
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