DocumentCode :
2537668
Title :
Development of encapsulated lithium hydride thermal energy storage
Author :
Olszewski, M. ; Siman-Tov, M.
Author_Institution :
Oak Ridge Nat. Lab., TN, USA
fYear :
1989
fDate :
6-11 Aug 1989
Firstpage :
2903
Abstract :
A packed-bed thermal storage (TES) unit using encapsulated LiH spheres has been proposed as a means of reducing the mass and size of space-based heat rejection systems in applications with pulsed power needs. Assessment of the concept indicated that mass and area savings are possible for applications having power generation periods as long as 1600 s. The major area of technical uncertainty is associated with shell stresses during heating, when the melting (and expanding) LiH at the shell surface is trapped between the encapsulating shell and the solid LiH core. A series of feasibility tests demonstrated that the LiH cracks during cooldown and that the LiH uses these paths to communicate with the central void during charging. The feasibility of the concept was proved conclusively in a reliability demonstration test series, when the 50 mm diameter encapsulated LiH test article completed 50 thermal cycles (twice the application lifetime). The work completed to date indicates that the proposed TES system has merit for pulses space power systems and that the encapsulated-LiH concept is feasible
Keywords :
lithium compounds; space vehicle power plants; thermal energy storage; TES; area savings; cooldown; encapsulated LiH thermal energy storage; feasibility tests; mass savings; packed-bed thermal storage; pulses space power systems; reliability; shell stresses; space-based heat rejection systems; Energy storage; Life testing; Lithium compounds; Power generation; Power system reliability; Pulse power systems; Space heating; Stress; Surface charging; Uncertainty;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1989. IECEC-89., Proceedings of the 24th Intersociety
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IECEC.1989.74406
Filename :
74406
Link To Document :
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